PhD student Tim Cheng’s paper on high deflection MEMS springs has published. The poster was presented at Transducers ’25 in Orlando (one of the top international conferences on MEMS) and the conference paper is now out on the IEEE portal. Good job, Tim!
T. J. Cheng, R. D. White and K. Oleske, “Deflection Characteristics of a Circular Slit Diaphragm MEMS Device,” 2025 23rd International Conference on Solid-State Sensors, Actuators and Microsystems (Transducers), Orlando, FL, USA, 2025, pp. 1445-1448, http://doi.org/10.1109/Transducers61432.2025.11109375